Class 09: PCB Stack up

PCB Stack up:

• PCB Material will be selected based on the signal transition time and application operating temperature

Next Class --> Signal Transmission

Class 08: PCB Traces

PCB Traces:

• Via Types
• Through hole via - Drill will go through top to bottom layer.
• Buried via - Drill is accesible from any one side. Top or bottom side. Another side connection in the inner layer
• Blind via - Via drill is not accessible from the top or bottom layer. Via is inbetween the inner layer.

Next Class - PCB Stack up

Class 07: PCB Component Packages

Component Packages

• PCBA shows typical items present on the board. Integrated Circuits(IC), Connectors, vias, trace,clock sources, resistor and capacitors.

• Standard discrete packages are shown in the above figure. (Resistor,capacitor, transistor and diode)

• Typical IC packages are shown in the figure. TSSOP, TQFP and BGA.

Next class ---> PCB traces

Class 06: PCB Gerber files

PCB Gerber files:

• Gerber files are the source files for the PCB manufacturing.
• Gerber files are used to generate a film.
• Standard files are required for the fabrication
• TOP Layer
• Bottom Layer
• Inner Layers (Power or Ground or routing)
• Top and bottom Mask
• Top and bottom Paste
• Top and bottom silk screen layer
• Top and Bottom assembly layer (for component assembly)
• Drill file (Inf on vias and mounting holes)
• Fab drawing that specify the drill,impedance and stack up information
• Power and Ground plane - Positive or negative layer.

Typical PCBA: (Assembled PCB)

• PCBA - Components mounted on PCB.Above board shows the digital circuit.

• Typical PCBA shows analog/power supply circuits on the board.

Next Class - PCB Components,Packages,stack up 

Class 05: PCB - Aspect Ratio, Solder Mask, Silk Screen

Aspect Ratio, Solder Mask, Silk Screen:

• Aspect ratio one of the parameter to decide the PCB board thickness.
• If board using small diameter and board thickness is more means the aspect ratio range may not met and PCB is not manufacturable. 

• Solder Mask protect the circuits (Copper) from oxidation and accidental short and shock to the human.
• In general, most of the PCB using the Green color solder mask. Now a days solder mask available in the black, red and blue color also.

• Surface finish is coat over the exposed conductor. In general, coat over the pads of the components, coat over gold finger etc. (Coat over the exposed copper). 
• Gold finish is used for the high speed circuits/signals.

• Silkscreen is reference of the components on the board.
• Mainly it is used to identify the design components in the PCB, Connector pin orientation, diode and tantalum/bulk capacitor,DC power Jack orientation, etc.

If you have any questions please email: miycircuits@gmail.com

Class04: PCB Manufacturing Method

PCB Manufacturing Method:

• Photomask generated from the gerber file. 
• Circuit pattern will be applied over the copper foil through photosensitive material.

• Etching step remove the copper that is not the part of the circuit.

• Milling is another method to remove the unwanted copper.

• Once etching completed, vias will be made using drilling bits based on via diameter.
• Now a days, vias with small diameter is made using laser.

Class03 : PCB Material

PCB Material:

• Core - Copper foil layer @ both side of the insulating material. 
• It is available on standard thickness and size.

• Copper conductors are available on the standard thickness. 
• 2oz copper is used for high current application. 

• Core Insulators are standard dielectric material.Most commonly used one is FR4.
• For high speed application and high temperature resistant the suitable material can be selected.

Class02- Printed Circuit Board -PCB

Printed Circuit Board (PCB)

What is PCB ?

PCB Design Process: 

• PCB Design Process
• 
  
• PCB Layout and Schematic Tool Library Creation based on the design
• Schematic Entry
• Netlist Export
• Layout 
• Gerber Generation
• CAM and Manufacturing Check
• PCB Fabrication

• What is Gerber

PCB Assembly Structure:

• Major Structure in PCB
• PCB Core
• Dielectric Material
• PCB Copper Layer
• Circuit Layer
• Solder Paste
• Solder Mask
• Silk Screen

If you have any questions please email to miycircuits@gmail.com

Class 01 - High Speed Board Design Techniques

Tutorial on High Speed Board Design Techniques 

• In this tutorial the following topics will be discussed

• PCB manufacturing process
• PCB Design terminology
• Signal Transmission
• Differential Signalling 
• Signal Integrity
• PCB Layout Rule for Signal Integrity
• Constraint Manager and PCB Layout Checklist

Welcome to High Speed Board design Class !

FPGA in Electrical Engineering: 

The High Speed Design Classes are starting tomorrow.

The Following topics will be covered

• PCB Manufacturing methods
• PCB terminology
• Signal Transmission
• Differential transmission
• Signal Integrity
• Layout Techniques for signal integrity reduction
• Constraint Manager and high Layout review techniques

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