Thursday 16 July 2015

Hardware Board Design Interview Questions - Part 10


171. What is the advantage of a open collector output?

172. What is leakage current?

173. What is DC analysis in the circuit simulation?

174. What is AC analysis in circuit simulation?

175. What is the difference between a strip line and micro strip? Which one is faster?

176. What is an asymmetric strip line?

177. What is a blind/buried via?

178. What are the different soldering techniques you are aware of?

179. How are through hole components soldered?

180. How are SMD components get soldered?

181. Propose a four layer stack up ?

182. Propose a Six layer stack up ?

183. What is the use of solder mask in pcb ?

184. What is the use of paste mask in pcb?

185. What is the difference between NAND and NOR flash ?

186. What is the difference between SRAM and DRAM? Which is faster?

187. What is the use of DQS signals on DDR?

188. Input and output circuit for the differential signal (LVDS)?

189. What is active region and cut-off region in transistor?

190. What is buffer?

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