Thursday 16 July 2015

Hardware Board Design Interview Questions- Part 11



191. What is the Avalanche breakdown in the diode?

192. What is relation between the trace impedance, width, dielectric height on the
        stripline and microstrip signals ?

193. What is load regulation and line regulation?

194. What is Wander ? difference to jitter ?

195.  Explain how the connectors/cables, power supply noise, high speed switching  
            devices, crosstalk, ground bounce and impedance are affecting the EMI?

196.  How the EMI is controlled by shielding, filtering, wiring, layout, power supply
         planes, decoupling, termination, return path.?

197.  Derive the equations for the gain for the each configuration?

198.  What is the crosstalk? How it will affect the signal quality?

199.  Why the decaps should be present very close the IC pins?

200.  What are the parameters on the board will affect the propagation delay?

201.  How to select the input inductor for the power supply?

202.  How to select the output capacitor for the power supply?

203.  Difference between the JK and SR flip flop?

204.  What is ADC, DAC specification?

205.  How the forward and backward cross talk will behave with respect to tr
          and propagation delay?

206.  When to use the scope and LA?

207.  How to terminate the bi-directional signals? (Data)

208.  How to design digital pulse extender?

209.  What is common mode voltage on the LVDS, LVPECL, and SSTL?

210.  How to implement the comparators using gates?

211.  How will you arrive at the maximum/minimum length of a trace in a PCB?

212.  Which trace geometry do you prefer for high speed signals?

213.  What are CFI commands in flash?

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