Hardware Board Design Interview Questions - Part 3

51. What is signal integrity? 

52.To ensure the board is signal integrity free what are the methods need to follow?

53.What is called return current ?

54. How the split plane and slots will affect the return current path? 

55. How the 90 bent routing and vias will affect the signal quality? 

56. What are the different types of the via?

57. What is forward crosstalk? What is backward cross talk? How it will behave in the 
       transmission line?

58. What is capacitive coupling? 

59. What is inductive coupling? 

60. How to reduce the cross talk?

61. What are different types of the dielectric capacitor and difference between them? 

62. What is the difference between the power bus and power plane? 

63. Draw a capacitor equivalent circuit? What are characteristics of the series resonance?

64. What is the impact of using two different value and type of the capacitor in parallel? 

65. What are the impacts of increasing the signal return path? 

66. What is the propagation delay? 

67. What is the distributed load and lumped load? 

68. What is the EMI filter?

69. How the ferrite beads suppress the noise? 

70. How to select the input ceramic capacitor for the power supplies?